5

5

4

4

3

3

2

2

1

1

D

D

C

C

B

B

A

A

11.AUDIO
12.LCD PANEL
13.TOUCH PANEL
14.HDMI/ATSC
15.CAMERA/G_SENSOR/KEY/COMP/IR

05.DC/CHARG

07.USB OTG/VIB
08.DDR3

03.Block Diagram

01. INDEX

04.SYSTEM POWER DIAGRAM

02.Modify note

09.FLASH/SD
10.GPIO

06.SYSTEM POWER

16.WIFI/3G
17.GPS

above 80 miles

PCB POWER WIRE WIDTH INDICATE

above 50 miles

above 16 miles

above 30 miles

Under needs

No indicate

CONTENT INDEXING

6 LAYERS PCB STACK

Hoz(18um) + plating copper(18um)

1oz(35um)

1oz(35um)

1oz(35um)

1oz(35um)

Hoz(18um) + plating copper(18um)

Prepreg    3313*1   4.0MIL(0.10mm)

Prepreg    3313*1   4.0MIL(0.10mm)

Core    3.94MIL(0.1mm)

Core    3.94MIL(0.1mm)

Adjust

GND

S1(S2)

GND(POWER)

S2(BOTTOM)

TOP

POWER(S1)

福州瑞芯微电子有限公司

REV:

Create  Date:

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Wednesday, December 14, 2011

Wednesday, February 22, 2012

17

1

1.0

RK3066_REF_2CELL

福州瑞芯微电子有限公司

REV:

Create  Date:

Title:

File:

Page  Num:

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Wednesday, December 14, 2011

Wednesday, February 22, 2012

17

1

1.0

RK3066_REF_2CELL

福州瑞芯微电子有限公司

REV:

Create  Date:

Title:

File:

Page  Num:

Page Total:

Modify Date:

Index

Wednesday, December 14, 2011

Wednesday, February 22, 2012

17

1

1.0

RK3066_REF_2CELL